教師個人簡歷
現職
國立中央大學
工學院化學工程與材料工程學系
教授
國立中央大學
研究發展處
研發長
國立中央大學
國立中央大學學術倫理辦公室
副主任
專長
先進電子構裝技術
薄膜太陽能電池
同步輻射於材料
Advanced electronic packaging technology
thin-film solar cells
synchrotron radiation in materials
專長簡述
先進電子構裝技術、薄膜太陽能電池、同步輻射於材料
最高學歷
美國University of California-Los Angeles
材料科學工程系
博士
科技部學門領域
政府GRB研究專長領域
教育部學門領域
高教深耕計畫
-
產學資源整合與新創團隊輔導
1150101~1151231
[產學資源整合、新創團隊輔導 , 無] -
專利技轉費用
1150101~1151231
[專利技轉費用 , 無] -
獎勵特聘教授
1150101~1151231
-
研究傑出獎
1150101~1151231
-
新聘傑出 & 年輕傑出教師
1150101~1151231
-
卓越研究促進方案
1150101~1151231
-
新進/年輕教師學術研究補助
1150101~1151231
-
中大講座-研發處撥款
1150101~1151231
-
客家講座-蕭新煌
1150101~1151231
-
化材系整合性教學創新計畫
1110101~1111231
-
idea mill 創意磨坊
1100101~1101231
-
化材系整合性教學創新計畫
1100101~1101231
-
化材系整合型教學創新計畫
1090101~1091231
其他補助
-
111年度「大學校院培育優秀博士生獎學金」(第4年)
1140901~1150831
[培育優秀博士生獎學金 , 培育優秀博士生獎學金] -
112年度「大學校院培育優秀博士生獎學金」(第3年)
1140901~1150831
[培育優秀博士生獎學金 , 培育優秀博士生獎學金] -
113年「國家科學及技術委員會博士生研究獎學金」-徵選類別(9月份入學)(第2年)
1140901~1150831
[國家科學及技術委員會博士生研究獎學金 , 國家科學及技術委員會博士生研究獎學金] -
113年「國家科學及技術委員會博士生研究獎學金」-徵選類別缺額(第2年)
1140901~1150831
[國家科學及技術委員會博士生研究獎學金 , 國家科學及技術委員會博士生研究獎學金] -
113年「國家科學及技術委員會博士生研究獎學金」-核配類別(第2年)
1140901~1150831
[國科會博士生研究獎學金 , 國科會博士生研究獎學金] -
114年「國家科學及技術委員會博士生研究獎學金」-徵選類別(9月份入學)
1140901~1150831
[國科會博士生研究獎學金 , 國科會博士生研究獎學金] -
114年「國家科學及技術委員會博士生研究獎學金」-核配類別
1140901~1150831
[國科會博士生研究獎學金 , 國科會博士生研究獎學金] -
114年補助大專校院實施特殊優秀人才彈性薪資
1140801~1150731
[114年補助大專校院實施特殊優秀人才彈性薪資 , 114年補助大專校院實施特殊優秀人才彈性薪資] -
114年度補助大專校院研究獎勵案(國科會)
1140801~1150731
[114年度補助大專校院研究獎勵案(國科會) , 114年度補助大專校院研究獎勵案(國科會)]
捐(受)贈收入
-
捐贈收入-(獎)教育部協助大專校院產學合作培育研發菁英計畫-台灣上村股份有限公司
1070801~1110731
-
捐贈收入-印能技股份有限公司(博士級人才培育獎助學金合約)
1060801~1100731
-
捐贈收入-財團法人桃園縣昇貿教育事務基金會(博士級人才培育獎助學金合約)
1060801~1100731
國科會計畫統計
-
先進電子構裝中介金屬化合物之電遷移機制與可靠度研究
1160801~1170731
-
先進電子構裝中介金屬化合物之電遷移機制與可靠度研究
1150801~1160731
-
應用於電子構裝晶片之薄膜熱電致冷模組
1150801~1160731
-
先進電子構裝中介金屬化合物之電遷移機制與可靠度研究
1140801~1150731
-
應用於電子構裝晶片之薄膜熱電致冷模組
1140801~1150731
-
應用於電子構裝晶片之薄膜熱電致冷模組
1130801~1140731
-
高功率元件構裝之銅膠接合技術研究
1130801~1140731
[銅-銅直接接合,微米/奈米銅粒子,低溫燒結 , Copper-copper direct bonding,mixed-sized particle,low temperature sintering] -
高功率元件構裝之銅膠接合技術研究
1120801~1130731
[銅-銅直接接合,微米/奈米銅粒子,低溫燒結 , Copper-copper direct bonding,mixed-sized particle,low temperature sintering] -
中溫鍺碲與錫碲熱電模組之界面反應與熱電性質研究
1120801~1130731
[熱電性質、交互擴散、擴散阻障層、碲化鍺、碲化錫 , Thin film material,Thermoelectric property,Interdiffusion,Diffusion barrier,GeTe,SnTe] -
中溫鍺碲與錫碲熱電模組之界面反應與熱電性質研究
1110801~1120731
[熱電性質、交互擴散、擴散阻障層、碲化鍺、碲化錫 , Thin film material,Thermoelectric property,Interdiffusion,Diffusion barrier,GeTe,SnTe] -
高功率元件構裝之銅膠接合技術研究
1110801~1120731
[銅-銅直接接合,微米/奈米銅粒子,低溫燒結 , Copper-copper direct bonding,mixed-sized particle,low temperature sintering] -
中溫鍺碲與錫碲熱電模組之界面反應與熱電性質研究
1100801~1110731
[熱電性質、交互擴散、擴散阻障層、碲化鍺、碲化錫 , Thin film material,Thermoelectric property,Interdiffusion,Diffusion barrier,GeTe,SnTe] -
常壓低溫銅接合技術
1100801~1111031
[銅-銅直接接合,奈米銅粒子,低溫燒結,還原劑,保護劑,固竭強絮作用 , direct bonding copper,Cu nano particle,low temperature sintering,reducing agent,capping agent,depletion flocculation] -
常壓低溫銅接合技術
1090801~1100731
[銅-銅直接接合,奈米銅粒子,低溫燒結,還原劑,保護劑,固竭強絮作用 , direct bonding copper,Cu nano particle,low temperature sintering,reducing agent,capping agent,depletion flocculation] -
薄膜熱電模組中金屬電極界面反應對熱電性質影響之研究
1090801~1101031
[薄膜材料,熱電性質,交互擴散,擴散阻障層,鉍碲基,鉛碲基,方鈷礦,鈷銻基,奈米複合物,摻雜 , Thin film material,thermoelectric property,interdiffusion,diffusion barrier,Bi2Te3,PbTe,Skutterudite,CoSb3,nanocomposite,doping] -
常壓低溫銅接合技術
1080801~1090731
[銅-銅直接接合,奈米銅粒子,低溫燒結,還原劑,保護劑,固竭強絮作用 , direct bonding copper,Cu nano particle,low temperature sintering,reducing agent,capping agent,depletion flocculation] -
薄膜熱電模組中金屬電極界面反應對熱電性質影響之研究
1080801~1090731
[薄膜材料,熱電性質,交互擴散,擴散阻障層,鉍碲基,鉛碲基,方鈷礦,鈷銻基,奈米複合物,摻雜 , Thin film material,thermoelectric property,interdiffusion,diffusion barrier,Bi2Te3,PbTe,Skutterudite,CoSb3,nanocomposite,doping] -
薄膜熱電模組中金屬電極界面反應對熱電性質影響之研究
1070801~1080731
[薄膜材料,熱電性質,交互擴散,擴散阻障層,鉍碲基,鉛碲基,方鈷礦,鈷銻基,奈米複合物,摻雜 , Thin film material,thermoelectric property,interdiffusion,diffusion barrier,Bi2Te3,PbTe,Skutterudite,CoSb3,nanocomposite,doping] -
低溫無鉛銲料之開發與低溫接合晶片翹曲之研究
1060801~1070731
-
無電鍍鈷擴散阻障層應用於低溫及中溫之碲基熱電模組
1060801~1070731
-
低溫無鉛銲料之開發與低溫接合晶片翹曲之研究
1050801~1060731
-
無電鍍鈷擴散阻障層應用於低溫及中溫之碲基熱電模組
1050801~1060731
-
低溫無鉛銲料之開發與低溫接合晶片翹曲之研究
1040801~1050731
-
無電鍍鈷擴散阻障層應用於低溫及中溫之碲基熱電模組
1040801~1050731
產學合作計畫統計
-
審查費-研發處-115-116年度
1150101~1161231
[無 , 無] -
中大國泰聯合研發中心管理費及行政協辦費用
1140901~1150831
[無 , 無] -
介電層改質提升抗缺陷能力與接合品質之研究
1140301~1150228
[半導體,先進封裝,介電層,摻雜 , semiconductor,advanced packaging,dielectric layer,doping] -
先進封裝材料及技術研究開發-第二階段
1140101~1150731
[先進構裝,無鉛銲料 ] -
無鉛低溫銲料添加木質纖維素之性質與應用性探討計畫
1130401~1150331
[無鉛銲料,木質纖維素,可靠度 , Lead-free solder,Lignocellulose,Reliability] -
結合晶片翹曲量測與接合界面探討接合品質之研究
1130301~1140228
[半導體,翹曲 , semiconductor,warpage] -
電路板產學聯合培育碩博士計畫
1120901~1150831
[電路板,半導體,產學合作 , PCB,Semi-conductor] -
先進封裝材料及技術研究開發
1120801~1150731
[先進構裝,無鉛銲料 , Advanced packaging,Pb-free solder] -
環境對二氧化矽薄膜性質與接合強度之研究
1120301~1130229
[二氧化矽,薄膜,半導體 , Silicon dioxide,Thin film,semiconductor] -
無鉛銲料添加木質纖維素之性質與應用性探討計畫
1110401~1121231
[無鉛銲料,木質纖維素,可靠度 , Lead-free solder,Lignocellulose,Reliability] -
感光性介電材料表面改質對黏著性影響之研究
1110301~1120228
[PCB板 , PCB] -
國立中央大學-台灣積體電路製造股份有限公司 「半導體製程/模組學程」
1100901~1120430
[半導體製程/模組工程學程 , 半導體製程/模組工程學程] -
輔導促進資源循環技術提升-含鎳廢液再生產品應用技術試生產及檢測
1100601~1101231
[含鎳廢液再生 ] -
甲酸低溫壓力焊接烤箱測試X-ray/切片分析
1091001~1100731
[低溫壓力焊接 ] -
真空高溫高壓脫泡迴焊烤箱開發計畫
1080316~1081130
-
車用電子基板表面處理可靠度之研究
1070401~1080430
-
抗氧化低溫接合材料設計與製程評估
1070401~1071210
-
The Research of Advanced Package
1060701~1080331
-
產學聯合培育碩博士計畫
1050201~1080131
-
新銲料合金之開發與可靠性評估
1050101~1080731
-
The Research on Technology of Advanced Packaging
1040101~1061231
期刊著作
-
Influence of solvent polarity on dispersion, agglomeration, and sintering of nano/microscale copper powder systems
Powder Technology, 469, 2026-02-28
[ Cu nanoparticle,Eco-friendly synthesis,Interconnects,Sintering,Solvent polarity ] -
Cu-whisker formation in Cu3Sn under coupled thermomigration and electromigration
Journal of Alloys and Compounds, 1048, 2025-12-10
[ Cu-whiskers,Cu3Sn,Electromigration,SiO2,Thermomigration ] -
Temperature dependence on ripening and spalling of interfacial (Cu,Ni)6Sn5 compound at SnAgCu(Ni)/Ni(P) interface
Intermetallics, 186, 2025-11-01
[ Dissolution,Interfacial reaction,Intermetallics,Lead-free solder,Phase diagram ] -
Sintering of Cu nanoparticles for optimized particle size and enhanced interconnect performance
Journal of the Taiwan Institute of Chemical Engineers, 173, 2025-08-01
[ Bonding,Cu nanoparticle,Eco-friendly reduction,Interfacial reduction,Sintering ] -
Enhancing Reliability and Durability of Solder Joints Using a Novel Sn-Ag-Bi-Ni Alloy
JOM, 77, 6, 4215-4225, 2025-06-01 -
Interfacial reaction and IMC growth kinetics at the Bi2Te3/Ag interface during isothermal aging
Intermetallics, 179, 2025-04-01
[ Ag sintering,IMC growth kinetics,Intermetallic compound,Microstructural evolution,Thermoelectric ] -
Abrasion Tests on Nanotwinned and Graphene-Doped Ag Films Prepared by Cyanide-Free Ag Electroplating
Tribology Transactions, 2025-01-01
[ Ag electroplating,Twinning ] -
Enhancing performance and thermal stability in GeTe thermoelectric joints with cobalt diffusion barrier
Materials Chemistry and Physics, 323, 2024-09-01
[ Contact resistivity,Diffusion barrier,GeTe,Interfacial stability,Thermoelectric properties ] -
Enhancement of Cu-to-Cu bonding property by residual stress in Cu substrate
Materials Characterization, 214, 2024-08-01
[ Cu nanoparticle,EBSD,Electronic packaging,Sintering,TEM,X-ray ] -
Preventing degradation of thermoelectric property after aging for Bi2Te3 thin film module
Materials Chemistry and Physics, 318, 2024-05-01
[ Bi2Te3,Copper,Long-term aging,Nickel,Thermoelectric property ] -
Electrical current enhanced sintering without Joule heating for Cu nanoparticles at room temperature
Materialia, 30, 2023-08-01
[ Electrically sintering mechanism,Interconnect,Low temperature process,Pressureless ] -
Mitigation of Power Factor Degradation in Bi2Te3 Thin Films
ACS Applied Engineering Materials, 1, 7, 1730-1738, 2023-07-15
[ Bi2Te3, thermoelectric thin film, copper diffusion, antisite defect, long-term aging ] -
The effect of microstructure for Ni-based surface finishing thin film on corrosion behavior
Surface and Coatings Technology, 456, 2023-03-15
[ Corrosion,Electroless plating,Electroplating,Microstructure,Sulfur dioxide ] -
Hybrid Solder Joint for Low-Temperature Bonding Application
Journal of Electronic Materials, 52, 2, 782-791, 2023-02-01
[ hybrid solder joint,low-temperature,SAC0307,SnBi ] -
Corrosion behaviors of Co, Co/Pd, and Co/Pd/Au surface finishes
Journal of the Taiwan Institute of Chemical Engineers, 138, 2022-09-01
[ Corrosion,Corrosion mechanism,Electrochemistry,Electroless cobalt,Surface finish ] -
Stoichiometric Effect of Sb2Te3 Thin Film on Thermoelectric Property
ACS Applied Energy Materials, 5, 6, 7026-7033, 2022-06-27
[ defect reaction,interfacial reaction,power factor,Sb2Te3,Seebeck coefficient,stoichiometric effect ] -
Novel solid-state pressureless approach for Cu-embedded intermetallic interconnects at low temperature
Materials Chemistry and Physics, 272, 2021-11-01
[ Interconnects,Interdiffusion,Intermetallics,Low-temperature process,Pressureless ] -
Low temperature and pressureless Cu-to-Cu direct bonding by green synthesized Cu nanoparticles
Journal of the Taiwan Institute of Chemical Engineers, 125, 394-401, 2021-08-01
[ Cu nanoparticle synthesis,Cu oxide reduction,Green chemistry,Low temperature bonding,Power electronic packaging,Sintering ] -
A comprehensive study of electromigration in pure Sn: Effects on crystallinity, microstructure, and electrical property
Acta Materialia, 200, 200-210, 2020-11-01
[ Dislocations,Electrical properties,Electromigration,Lattice disruption,Tin ] -
Interfacial Stability in Bi2Te3Thermoelectric Joints
ACS applied materials & interfaces, 12, 24, 27001-27009, 2020-06-17
[ Bi2Te3,diffusion barrier,fracture mode,interfacial stability,shear strength,thermoelectric properties ] -
Joint properties enhancement for PbTe thermoelectric materials by addition of diffusion barrier
Materials Chemistry and Physics, 246, 2020-05-01
[ Diffusion barrier,Interfacial reaction,Mechanical strength,PbTe,Thermoelectric materials ] -
Improvement of high-temperature thermal aging reliability of Ag–Au joints by modifying Ni/Au surface finish
Journal of Materials Science: Materials in Electronics, 30, 22, 20292-20301, 2019-11-01 -
Effect of Sn Film Grain Size and Thickness on Kinetics of Spontaneous Sn Whisker Growth
JOM, 71, 9, 3041-3048, 2019-09-15 -
Corrosion on automobile printed circuit broad
Microelectronics Reliability, 98, 19-23, 2019-07-01
[ Automobile printed circuit broad,Electroless cobalt layer,Gaseous corrosion,Sulfur dioxide,Surface finish ] -
Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates
Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing, 759, 506-513, 2019-06-24
[ Bi , In , Interfacial reaction , Low-temperature alloys , Mechanical strength ] -
Co-P Diffusion Barrier for p-Bi2Te3 Thermoelectric Material
Journal of Electronic Materials, 48, 1, 53-57, 2019-01-15
[ diffusion barrier , electroless Co-P , interfacial reaction , shear strength , Thermoelectric materials ] -
Co-sputtered Cu(Ti) thin alloy film for formation of Cu diffusion and chip-level bonding
Materials Chemistry and Physics, 211, 17-22, 2018-06-01
[ Co-sputtered Cu(Ti) , Cu bonding , Phase separation , Thermo-compression ] -
Interfacial reactions in thermoelectric modules
Materials Research Letters, 6, 4, 244-248, 2018-04-03
[ Bi Te 2 3 , Interfacial reaction , PbTe , Thermoelectric (TE) material and module ] -
Study of Diffusion Barrier for Solder/n-Type Bi2Te3 and Bonding Strength for p- and n-Type Thermoelectric Modules
Journal of Electronic Materials, 47, 1, 148-154, 2018-01-01
[ Bi Te 2 3 , diffusion barrier , electroless Ni-P , interfacial reaction , shear strength , thermoelectric module ] -
Zirconia/acrylate nanocomposite hard-coat
Recent Innovations in Chemical Engineering, 11, 3, 160-171, 2018-01-01
[ Abrasion resistance , Organic-inorganic nanocomposite , Refractive index , Surface modification , Uv , Zirconia nanocrystal ] -
Analysis of arrayed nanocapacitor formed on nanorods by flow-rate interruption atomic layer deposition
Applied Surface Science, 426, 224-228, 2017-12-31
[ Atomic layer deposition , Hydrothermal growth , Nanocapacitor , Nanosphere lithography , ZnO nanorod arrays ] -
Assessment of microstructure and shear strength for low melting point tin-free alloys on Cu
Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing, 708, 142-148, 2017-12-21
[ Bi , In , Low melting point alloy , Shear strength ] -
Crystallographic Orientation Effect on Electromigration in Ni-Sn Microbump
JOM, 69, 9, 1717-1723, 2017-09-01 -
Epitaxial growth of ZnO nanorod arrays via a self-assembled microspheres lithography
Applied Surface Science, 414, 212-217, 2017-08-31
[ Epitaxial growth , Hydrothermal growth , Nanosphere lithography , Zinc oxide nanorod arrays ] -
Effect of phase separation on mechanical strength of co-sputtering Cu(Ti) thin film in chip-level 3DIC bonding
Materials Letters, 189, 93-96, 2017-02-15
[ Co-sputtered Cu(Ti) , Cu bonding , Electronic materials , Phase separation , Shear test , Sputtering ] -
Electroless Co-P diffusion barrier for n-PbTe thermoelectric material
Journal of Alloys and Compounds, 728, 1023-1029, 2017-01-01
[ Diffusion , Phase transitions , Solid state reaction , Thermoelectric materials ] -
In Situ Electromigration in Cu-Sn and Ni-Sn Critical Solder Length for Three-Dimensional Integrated Circuits
Journal of Electronic Materials, 45, 12, 6163-6170, 2016-12-01
[ backstress , Diffusion , microstructure ] -
Si1−xGex photodiode with segregated Ge nanocrystals
Materials Letters, 184, 308-311, 2016-12-01
[ Electronic materials , Ge segregation , Nanocrystal , Optical materials and properties ] -
Effect of massive spalling on mechanical strength of solder joints in Pb-free solder reflowed on Co-based surface finishes
Journal of Alloys and Compounds, 671, 100-108, 2016-06-25
[ Co-Sn-P , Intermetallic compound , Massive spalling , Multiple reflows , SAC305 , Shear test ] -
Evolution of residual stress and qualitative analysis of Sn whiskers with various microstructures
Journal of Materials Science, 51, 7, 3600-3606, 2016-04-01 -
Disruption of crystalline structure of Sn3.5Ag induced by electric current
, 119, 11, 2016-03-21 -
Interfacial Reactions of Low-Melting Sn-Bi-Ga Solder Alloy on Cu Substrate
Journal of Electronic Materials, 45, 1, 197-202, 2016-01-01
[ bismuth,gallium,interfacial reaction,Low-melting solder,tin ] -
High dislocation density of tin induced by electric current
, 5, 12, 2015-12-01 -
Evolution of the Intermetallic Compounds in Ni/Sn-2.5Ag/Ni Microbumps for Three-Dimensional Integrated Circuits
Journal of Electronic Materials, 44, 10, 3888-3895, 2015-10-05
[ 3D IC , intermetallic compounds , kinetics analysis , Microbump ] -
In Situ Synchrotron X-ray Diffraction Measurement of the Strain Distribution in Si Die for the Embedded Substrates
Journal of Electronic Materials, 44, 10, 3942-3947, 2015-10-05
[ in situ strain measurement , interposer , Three-dimensional integrated circuits ] -
Metastable Ge nanocrystalline in SiGe matrix for photodiode
Applied Surface Science, 349, 387-392, 2015-09-15
[ High-resolution transmission electron microscopy , Metastable SiGe , Nanocrystalline Ge , Rapid thermal annealing ] -
The diminishing of crystal structure of Sn9Zn alloy due to electrical current stressing
Journal of Alloys and Compounds, 619, 372-377, 2015-01-15
[ Crystal structure , Current stressing , Strain , X-ray Diffraction ] -
Back-fill Sn flux against current-stressing at cathode micro Cu/Sn interface
ECS Solid State Letters, 3, 2, 2014-03-13 -
Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits
, 115, 3, 2014-02-10 -
Effect of metal bond-pad configurations on the solder microstructure development of flip-chip solder joints
Journal of Electronic Materials, 43, 1, 170-175, 2014-01-01
[ flip chip , IC packaging , lead-free solder , microstructure ] -
Evaluation of strain measurement in a die-to-interposer chip using in situ synchrotron X-Ray diffraction and finite-element analysis
Journal of Electronic Materials, 43, 1, 52-56, 2014-01-01
[ 3D IC , in situ strain measurement , interposer ] -
Polarity effect in a Sn3Ag0.5Cu/bismuth telluride thermoelectric system
Journal of Electronic Materials, 43, 1, 284-289, 2014-01-01
[ Bi Te 2 3 , electromigration , Ni-P , peltier effect , spark plasma sintering , thermoelectric materials ] -
Kinetic analysis of spontaneous whisker growth on pre-treated surfaces with weak oxide
Journal of Electronic Materials, 43, 9, 3290-3295, 2014-01-01
[ Diffusion , intermetallic compounds , oxidation , synchrotron radiation x-ray ] -
High surface textured SnO 2 hybrid thin films fabricated using the nozzle-spraying process for solar cell applications
Applied Surface Science, 277, 30-34, 2013-07-15
[ Chemical vapor deposition , Nozzle-spraying process , Surface-textured , Thin-film solar cells , Tin oxide thin films , Transparent conducting oxide ] -
Bandgap narrowing in high dopant tin oxide degenerate thin film produced by atmosphere pressure chemical vapor deposition
, 102, 11, 2013-03-18 -
Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress
Scripta Materialia, 68, 5, 317-320, 2013-03-01
[ Dissolution , Electromigration , Intermetallic compounds , Recrystallization , Synchrotron radiation ] -
Electrorecrystallization of Metal Alloy
Journal of Alloys and Compounds, 549, 190-194, 2013-02-05
[ Electromigration , Recrystallization , Solder , Supersaturation ] -
Reliability of micro-interconnects in 3D IC packages
Microelectronics Reliability, 53, 1, 2013-01-01 -
Massive spalling and morphological change of intermetallic compound affected by adding Pd in Co-based surface finishes
Journal of Alloys and Compounds, 580, 195-200, 2013-01-01
[ CoSn3 , Intermetallic compound , Mass spalling , Palladium , Surface energy ] -
Evaluation of diffusion barrier between pure Sn and Te
Journal of Electronic Materials, 41, 12, 3320-3324, 2012-12-01
[ Diffusion barrier , Electroless cobalt , Electroless nickel , Pb-free solder , Tellurium , Thermoelectric material ] -
Interfacial reactions between diffusion barriers and thermoelectric materials under current stressing
Journal of Electronic Materials, 41, 12, 3325-3330, 2012-12-01
[ Bismuth telluride , Electroless nickel , Electromigration , Thermoelectric material ] -
Analysis of chlorine ions in antimony-doped tin oxide thin film using synchrotron grazing incidence X-ray diffraction
Japanese Journal of Applied Physics, 51, 10 PART 2, 2012-10-01 -
Current redistribution by intermetallic compounds in Through-Silicon-Via (TSV)
Materials Chemistry and Physics, 132, 1, 162-165, 2012-01-16
[ Computer modelling and simulation , Electrical properties , Intermetallic compounds , Thin films ] -
Evaluation of diffusion barrier between lead-free solder systems and thermoelectric materials
Journal of Electronic Materials, 41, 1, 153-158, 2012-01-01
[ diffusion barrier , Pb-free solder , Thermoelectric ] -
Elucidating the metal-induced crystallization and diffusion behavior of Al/a-Ge thin films
Journal of Electronic Materials, 41, 1, 159-165, 2012-01-01
[ Al-Ge , eutectic bonding , hermetic sealing , layer exchange , MEMS packaging , MIC ] -
Nucleation and propagation of voids in microbumps for 3 dimensional integrated circuits
, 99, 25, 2011-12-19 -
Controlled positions and kinetic analysis of spontaneous tin whisker growth
, 99, 13, 2011-09-26 -
Scratch-resistant zeolite anti-reflective coating on glass for solar applications
Solar Energy Materials and Solar Cells, 95, 7, 1694-1700, 2011-07-01
[ AR coating , Elastic modulus , Nanoindent , Pencil hardness , Refractive index , Zeolite ] -
Preferred orientation relationships with large misfit interfaces between Ni3Sn4 and Ni in reactive wetting of eutectic SnPb on Ni
, 109, 12, 2011-06-15 -
Effects on undercooling and interfacial reactions with Cu substrates of adding Bi and in to Sn-3Ag solder
Journal of Electronic Materials, 39, 11, 2397-2402, 2010-11-01
[ Bismuth , Growth kinetics , Indium , Pb-free solder , Sn-Ag ] -
In situ observation of stress evolution in pure tin strip under electromigration using synchrotron radiation x-ray
Journal of Materials Research, 25, 2, 292-295, 2010-02-01 -
Journal of Electronic Materials: Foreword
Journal of Electronic Materials, 38, 12, 2427-2428, 2009-12-01 -
Determination of average failure time and microstructural analysis of Sn-Ag-Bi-In solder under electromigration
Journal of Electronic Materials, 38, 12, 2780-2785, 2009-12-01
[ Average failure time , Electromigration , Intermetallic compound , Pb-free solder , Sn-Ag-Bi , Sn-Ag-Bi-In ] -
Formation of intermetallic compounds in SnAgBiIn solder systems on Cu substrates
Journal of Alloys and Compounds, 476, 1-2, 436-440, 2009-05-12
[ Intermetallic compounds , Kinetic analysis , Pb-free solders , SnAgBiIn solder systems ] -
The suppression of tin whisker growth by the coating of tin oxide nano particles and surface treatment
Microelectronics Reliability, 49, 3, 318-322, 2009-03-01 -
The effects of solid-state aging on the intermetallic compounds of Sn-Ag-Bi-In solders on Cu substrates
Journal of Electronic Materials, 38, 2, 252-256, 2009-02-01
[ Kirkendall void , Pb-free , Sn-Ag-Bi-In solder , Solid-state aging ] -
In situ measurements of thermal and electrical effects of strain in flip-chip silicon dies using synchrotron radiation x-rays
Journal of Electronic Materials, 38, 11, 2308-2313, 2009-01-01
[ Electromigration , Flip chip , Measurement , Silicon die , Strain , Synchrotron radiation x-rays , Thermal effect ] -
Direct observation and kinetic analysis of grain rotation in anisotropic tin under electromigration
, 92, 12, 2008-04-03 -
Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads
Journal of Electronic Materials, 36, 7, 753-759, 2007-07-01
[ Current crowding , Electromigration , Flip chip , Joule heating , Sn-8Zn-3Bi ] -
Stress analysis of spontaneous Sn whisker growth
Journal of Materials Science: Materials in Electronics, 18, 1-3, 269-281, 2007-03-01 -
Interfacial stability of eutectic SnPb solder and composite 60Pb40Sn solder on Cu/Ni(V)/Ti under-bump metallization
Journal of Materials Research, 22, 3, 735-741, 2007-03-01 -
Mechanism and prevention of spontaneous tin whisker growth
Materials Transactions, 46, 11, 2300-2308, 2005-11-01
[ Lead-free , Spontaneous growth , Tin whisker , X-ray microdiffraction ] -
Electromigration-induced grain rotation in anisotropic conducting beta tin
, 86, 24, 1-3, 2005-06-13 -
Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction
, 85, 13, 2490-2492, 2004-09-27
研討會著作
-
Cu Nanoparticle Sintering by Electrical Current
107-108, 2024-01-01
[ Cu nanoparticle,Current crowding,Electrical current,Joule heating,Sintering ] -
Develop new solder alloy for high reliability device
1144-1147, 2024-01-01
[ drop test,high reliability,solder joint,TCT,thermal fatigue ] -
Hybrid SnBi/SAC Low-Temperature Solder Bump
213-214, 2023-01-01
[ low-temperature solder,mechanical strength,SAC,SnBi ] -
Corrosion resistance of surface finishes for high reliability devices
206-209, 2019-01-24
-
Development of low temperature solder alloys for advanced electronic packaging: Assessment of In-Bi alloys on Cu substrates
128-131, 2018-06-06
[ Bi , In , Low temperature alloy ] -
Creep corrosion on high reliability printed circuit boards
156-158, 2016-12-27
-
Development of New Low Melting Solder Alloys
2501-2506, 2016-08-16
[ Ga , In-Bi , Low metling point solder ] -
Non-destructive testing method for chip warpage -Applications of synchrotron radiation X-ray
15-18, 2016-06-07
[ Si-on-Si interposer , Synchrotron radiation X-ray , Warpage ] -
Massive spalling in Pb-free solder on co-based surface finishes
586-589, 2015-01-01
[ Cobalt , massive spalling , shear strenrth , surface finish ] -
Analysis of antimony doped SnO 2 thin film by synchrotron grazing incidence X-ray diffraction
001768-001770, 2011-12-01
-
Electrical current induced local thermal stress caused on stacked 3D-ICs
2010-12-01
-
The in-situ measurement of thermal stress on stacked 3D-IC by utilizing synchrotron radiation x-ray
2010-12-01
-
The composition of intermetallic compounds in Sn-Ag-Bi-In solders on Cu substrates
209-211, 2008-12-01
-
Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton
363-367, 2005-12-19
-
Microstructure evolution of tin under electromigration studied by synchrotron x-ray micro-diffraction
178-180, 2005-12-01
專書
-
Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics
269-281, 2007-12-01
校內獲獎
- 115 研究傑出獎
- 114 研究傑出獎
- 113 研究傑出獎
- 113 拔尖產學貢獻獎
- 112 研究傑出獎
- 112 優良產學貢獻獎
- 111 研究傑出獎
- 110 研究傑出獎
- 109 研究傑出獎
- 108 研究傑出獎
- 107 研究傑出獎
- 106 研究傑出獎
- 105 研究傑出獎
著作審查:
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111 ~ 111
Intermetallics
ISSN 0966-9795 EISSN 1879-0216
無 -
111 ~ 111
Thin Solid Films
ISSN 0040-6090 EISSN 1879-2731
無 -
110 ~ 111
Materials Chemistry and Physics
ISSN 0254-0584 EISSN 1879-3312
無 -
110 ~ 111
Journal of Alloys and Compounds
ISSN 0925-8388 EISSN 1873-4669
無 -
109 ~ 111
Journal of Materials Science: Materials in Electronics
ISSN 0957-4522 EISSN 1573-482X
無 -
109 ~ 111
Journal of Materials Research and Technology
EISSN 2238-7854
無 -
108 ~ 111
ACS Applied Electronic Materials
EISSN 2637-6113
無 -
108 ~ 111
Materials Letters
ISSN 0167-577X EISSN 1873-4979
無 -
107 ~ 111
Applied Surface Science
ISSN 0169-4332 EISSN 1873-5584
無
期刊編輯
-
109 ~ 111
JOM
ISSN 1047-4838 EISSN 1543-1851
無 -
109 ~ 111
Journal of Electronic Materials
ISSN 0361-5235 EISSN 1543-186X
無
國立中央大學