高教深耕計畫

• 化材系整合性教學創新計畫
  1110101~1111231
  

• idea mill 創意磨坊
  1100101~1101231
  

• 化材系整合性教學創新計畫
  1100101~1101231
  

• 化材系整合型教學創新計畫
  1090101~1091231
  

捐(受)贈收入

• 捐贈收入-(獎)教育部協助大專校院產學合作培育研發菁英計畫-台灣上村股份有限公司
  1070801~1110731
  

• 捐贈收入-印能技股份有限公司(博士級人才培育獎助學金合約)
  1060801~1100731
  

• 捐贈收入-財團法人桃園縣昇貿教育事務基金會(博士級人才培育獎助學金合約)
  1060801~1100731
  

國科會計畫統計

• 應用於電子構裝晶片之薄膜熱電致冷模組
  1150801~1160731
  

• 應用於電子構裝晶片之薄膜熱電致冷模組
  1140801~1150731
  

• 應用於電子構裝晶片之薄膜熱電致冷模組
  1130801~1140731
  

• 高功率元件構裝之銅膠接合技術研究
  1130801~1140731
  

• 中溫鍺碲與錫碲熱電模組之界面反應與熱電性質研究
  1120801~1130731
  [熱電性質、交互擴散、擴散阻障層、碲化鍺、碲化錫 , Thin film material,Thermoelectric property,Interdiffusion,Diffusion barrier,GeTe,SnTe]

• 高功率元件構裝之銅膠接合技術研究
  1120801~1130731
  

• 高功率元件構裝之銅膠接合技術研究
  1110801~1120731
  

• 中溫鍺碲與錫碲熱電模組之界面反應與熱電性質研究
  1110801~1120731
  [熱電性質、交互擴散、擴散阻障層、碲化鍺、碲化錫 , Thin film material,Thermoelectric property,Interdiffusion,Diffusion barrier,GeTe,SnTe]

• 常壓低溫銅接合技術
  1100801~1111031
  [銅-銅直接接合,奈米銅粒子,低溫燒結,還原劑,保護劑,固竭強絮作用 , direct bonding copper,Cu nano particle,low temperature sintering,reducing agent,capping agent,depletion flocculation]

• 中溫鍺碲與錫碲熱電模組之界面反應與熱電性質研究
  1100801~1110731
  [熱電性質、交互擴散、擴散阻障層、碲化鍺、碲化錫 , Thin film material,Thermoelectric property,Interdiffusion,Diffusion barrier,GeTe,SnTe]

• 常壓低溫銅接合技術
  1090801~1100731
  [銅-銅直接接合,奈米銅粒子,低溫燒結,還原劑,保護劑,固竭強絮作用 , direct bonding copper,Cu nano particle,low temperature sintering,reducing agent,capping agent,depletion flocculation]

• 薄膜熱電模組中金屬電極界面反應對熱電性質影響之研究
  1090801~1101031
  [薄膜材料,熱電性質,交互擴散,擴散阻障層,鉍碲基,鉛碲基,方鈷礦,鈷銻基,奈米複合物,摻雜 , Thin film material,thermoelectric property,interdiffusion,diffusion barrier,Bi2Te3,PbTe,Skutterudite,CoSb3,nanocomposite,doping]

• 薄膜熱電模組中金屬電極界面反應對熱電性質影響之研究
  1080801~1090731
  [薄膜材料,熱電性質,交互擴散,擴散阻障層,鉍碲基,鉛碲基,方鈷礦,鈷銻基,奈米複合物,摻雜 , Thin film material,thermoelectric property,interdiffusion,diffusion barrier,Bi2Te3,PbTe,Skutterudite,CoSb3,nanocomposite,doping]

• 常壓低溫銅接合技術
  1080801~1090731
  [銅-銅直接接合,奈米銅粒子,低溫燒結,還原劑,保護劑,固竭強絮作用 , direct bonding copper,Cu nano particle,low temperature sintering,reducing agent,capping agent,depletion flocculation]

• 薄膜熱電模組中金屬電極界面反應對熱電性質影響之研究
  1070801~1080731
  [薄膜材料,熱電性質,交互擴散,擴散阻障層,鉍碲基,鉛碲基,方鈷礦,鈷銻基,奈米複合物,摻雜 , Thin film material,thermoelectric property,interdiffusion,diffusion barrier,Bi2Te3,PbTe,Skutterudite,CoSb3,nanocomposite,doping]

• 低溫無鉛銲料之開發與低溫接合晶片翹曲之研究
  1060801~1070731
  

• 無電鍍鈷擴散阻障層應用於低溫及中溫之碲基熱電模組
  1060801~1070731
  

• 無電鍍鈷擴散阻障層應用於低溫及中溫之碲基熱電模組
  1050801~1060731
  

• 低溫無鉛銲料之開發與低溫接合晶片翹曲之研究
  1050801~1060731
  

• 低溫無鉛銲料之開發與低溫接合晶片翹曲之研究
  1040801~1050731
  

• 無電鍍鈷擴散阻障層應用於低溫及中溫之碲基熱電模組
  1040801~1050731
  

產學合作計畫統計

• 介電層改質提升抗缺陷能力與接合品質之研究
  1140301~1150228
  [半導體,先進封裝,介電層,摻雜 , semiconductor,advanced packaging,dielectric layer,doping]

• 先進封裝材料及技術研究開發-第二階段
  1140101~1150731
  [先進構裝,無鉛銲料 ]

• 無鉛低溫銲料添加木質纖維素之性質與應用性探討計畫
  1130401~1140930
  [無鉛銲料,木質纖維素,可靠度 , Lead-free solder,Lignocellulose,Reliability]

• 結合晶片翹曲量測與接合界面探討接合品質之研究
  1130301~1140228
  [半導體,翹曲 , semiconductor,warpage]

• 電路板產學聯合培育碩博士計畫
  1120901~1150831
  [電路板,半導體,產學合作 , PCB,Semi-conductor]

• 先進封裝材料及技術研究開發
  1120801~1150731
  [先進構裝,無鉛銲料 , Advanced packaging,Pb-free solder]

• 環境對二氧化矽薄膜性質與接合強度之研究
  1120301~1130229
  [二氧化矽,薄膜,半導體 , Silicon dioxide,Thin film,semiconductor]

• 無鉛銲料添加木質纖維素之性質與應用性探討計畫
  1110401~1121231
  [無鉛銲料,木質纖維素,可靠度 , Lead-free solder,Lignocellulose,Reliability]

• 感光性介電材料表面改質對黏著性影響之研究
  1110301~1120228
  [PCB板 , PCB]

• 國立中央大學－台灣積體電路製造股份有限公司 「半導體製程/模組學程」
  1100901~1120430
  [半導體製程/模組工程學程 , 半導體製程/模組工程學程]

• 輔導促進資源循環技術提升-含鎳廢液再生產品應用技術試生產及檢測
  1100601~1101231
  [含鎳廢液再生 ]

• 甲酸低溫壓力焊接烤箱測試X-ray/切片分析
  1091001~1100731
  [低溫壓力焊接 ]

• 真空高溫高壓脫泡迴焊烤箱開發計畫
  1080316~1081130
  

• 車用電子基板表面處理可靠度之研究
  1070401~1080430
  

• 抗氧化低溫接合材料設計與製程評估
  1070401~1071210
  

• The Research of Advanced Package
  1060701~1080331
  

• 產學聯合培育碩博士計畫
  1050201~1080131
  

• 新銲料合金之開發與可靠性評估
  1050101~1080731
  

• The Research on Technology of Advanced Packaging
  1040101~1061231
  

期刊著作

• Interfacial reaction and IMC growth kinetics at the Bi2Te3/Ag interface during isothermal aging
  Intermetallics, 179, 2025-04-01
  [ Ag sintering,IMC growth kinetics,Intermetallic compound,Microstructural evolution,Thermoelectric ]

• Enhancing performance and thermal stability in GeTe thermoelectric joints with cobalt diffusion barrier
  Materials Chemistry and Physics, 323, 2024-09-01
  [ Contact resistivity,Diffusion barrier,GeTe,Interfacial stability,Thermoelectric properties ]

• Enhancement of Cu-to-Cu bonding property by residual stress in Cu substrate
  Materials Characterization, 214, 2024-08-01
  [ Cu nanoparticle,EBSD,Electronic packaging,Sintering,TEM,X-ray ]

• Preventing degradation of thermoelectric property after aging for Bi2Te3 thin film module
  Materials Chemistry and Physics, 318, 2024-05-01
  [ Bi2Te3,Copper,Long-term aging,Nickel,Thermoelectric property ]

• Electrical current enhanced sintering without Joule heating for Cu nanoparticles at room temperature
  Materialia, 30, 2023-08-01
  [ Electrically sintering mechanism,Interconnect,Low temperature process,Pressureless ]

• Mitigation of Power Factor Degradation in Bi2Te3 Thin Films
  ACS Applied Engineering Materials, 1, 7, 1730-1738, 2023-07-15
  [ Bi2Te3, thermoelectric thin film, copper diffusion, antisite defect, long-term aging ]

• The effect of microstructure for Ni-based surface finishing thin film on corrosion behavior
  Surface and Coatings Technology, 456, 2023-03-15
  [ Corrosion,Electroless plating,Electroplating,Microstructure,Sulfur dioxide ]

• Hybrid Solder Joint for Low-Temperature Bonding Application
  Journal of Electronic Materials, 52, 2, 782-791, 2023-02-01
  [ hybrid solder joint,low-temperature,SAC0307,SnBi ]

• Corrosion behaviors of Co, Co/Pd, and Co/Pd/Au surface finishes
  Journal of the Taiwan Institute of Chemical Engineers, 138, 2022-09-01
  [ Corrosion,Corrosion mechanism,Electrochemistry,Electroless cobalt,Surface finish ]

• Stoichiometric Effect of Sb2Te3 Thin Film on Thermoelectric Property
  ACS Applied Energy Materials, 5, 6, 7026-7033, 2022-06-27
  [ defect reaction,interfacial reaction,power factor,Sb2Te3,Seebeck coefficient,stoichiometric effect ]

• Novel solid-state pressureless approach for Cu-embedded intermetallic interconnects at low temperature
  Materials Chemistry and Physics, 272, 2021-11-01
  [ Interconnects,Interdiffusion,Intermetallics,Low-temperature process,Pressureless ]

• Low temperature and pressureless Cu-to-Cu direct bonding by green synthesized Cu nanoparticles
  Journal of the Taiwan Institute of Chemical Engineers, 125, 394-401, 2021-08-01
  [ Cu nanoparticle synthesis,Cu oxide reduction,Green chemistry,Low temperature bonding,Power electronic packaging,Sintering ]

• A comprehensive study of electromigration in pure Sn: Effects on crystallinity, microstructure, and electrical property
  Acta Materialia, 200, 200-210, 2020-11-01
  [ Dislocations,Electrical properties,Electromigration,Lattice disruption,Tin ]

• Interfacial Stability in Bi2Te3Thermoelectric Joints
  ACS applied materials & interfaces, 12, 24, 27001-27009, 2020-06-17
  [ Bi2Te3,diffusion barrier,fracture mode,interfacial stability,shear strength,thermoelectric properties ]

• Joint properties enhancement for PbTe thermoelectric materials by addition of diffusion barrier
  Materials Chemistry and Physics, 246, 2020-05-01
  [ Diffusion barrier,Interfacial reaction,Mechanical strength,PbTe,Thermoelectric materials ]

• Improvement of high-temperature thermal aging reliability of Ag–Au joints by modifying Ni/Au surface finish
  Journal of Materials Science: Materials in Electronics, 30, 22, 20292-20301, 2019-11-01

• Effect of Sn Film Grain Size and Thickness on Kinetics of Spontaneous Sn Whisker Growth
  JOM, 71, 9, 3041-3048, 2019-09-15

• Corrosion on automobile printed circuit broad
  Microelectronics Reliability, 98, 19-23, 2019-07-01
  [ Automobile printed circuit broad,Electroless cobalt layer,Gaseous corrosion,Sulfur dioxide,Surface finish ]

• Interfacial reactions of 68In–32Bi, 50In–50Bi and 33In–67Bi low melting alloys on Cu substrates
  Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing, 759, 506-513, 2019-06-24
  [ Bi , In , Interfacial reaction , Low-temperature alloys , Mechanical strength ]

• Co-P Diffusion Barrier for p-Bi2Te3 Thermoelectric Material
  Journal of Electronic Materials, 48, 1, 53-57, 2019-01-15
  [ diffusion barrier , electroless Co-P , interfacial reaction , shear strength , Thermoelectric materials ]

• Co-sputtered Cu(Ti) thin alloy film for formation of Cu diffusion and chip-level bonding
  Materials Chemistry and Physics, 211, 17-22, 2018-06-01
  [ Co-sputtered Cu(Ti) , Cu bonding , Phase separation , Thermo-compression ]

• Interfacial reactions in thermoelectric modules
  Materials Research Letters, 6, 4, 244-248, 2018-04-03
  [ Bi Te 2 3 , Interfacial reaction , PbTe , Thermoelectric (TE) material and module ]

• Study of Diffusion Barrier for Solder/n-Type Bi2Te3 and Bonding Strength for p- and n-Type Thermoelectric Modules
  Journal of Electronic Materials, 47, 1, 148-154, 2018-01-01
  [ Bi Te 2 3 , diffusion barrier , electroless Ni-P , interfacial reaction , shear strength , thermoelectric module ]

• Zirconia/acrylate nanocomposite hard-coat
  Recent Innovations in Chemical Engineering, 11, 3, 160-171, 2018-01-01
  [ Abrasion resistance , Organic-inorganic nanocomposite , Refractive index , Surface modification , Uv , Zirconia nanocrystal ]

• Analysis of arrayed nanocapacitor formed on nanorods by flow-rate interruption atomic layer deposition
  Applied Surface Science, 426, 224-228, 2017-12-31
  [ Atomic layer deposition , Hydrothermal growth , Nanocapacitor , Nanosphere lithography , ZnO nanorod arrays ]

• Assessment of microstructure and shear strength for low melting point tin-free alloys on Cu
  Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing, 708, 142-148, 2017-12-21
  [ Bi , In , Low melting point alloy , Shear strength ]

• Crystallographic Orientation Effect on Electromigration in Ni-Sn Microbump
  JOM, 69, 9, 1717-1723, 2017-09-01

• Epitaxial growth of ZnO nanorod arrays via a self-assembled microspheres lithography
  Applied Surface Science, 414, 212-217, 2017-08-31
  [ Epitaxial growth , Hydrothermal growth , Nanosphere lithography , Zinc oxide nanorod arrays ]

• Effect of phase separation on mechanical strength of co-sputtering Cu(Ti) thin film in chip-level 3DIC bonding
  Materials Letters, 189, 93-96, 2017-02-15
  [ Co-sputtered Cu(Ti) , Cu bonding , Electronic materials , Phase separation , Shear test , Sputtering ]

• Electroless Co-P diffusion barrier for n-PbTe thermoelectric material
  Journal of Alloys and Compounds, 728, 1023-1029, 2017-01-01
  [ Diffusion , Phase transitions , Solid state reaction , Thermoelectric materials ]

• In Situ Electromigration in Cu-Sn and Ni-Sn Critical Solder Length for Three-Dimensional Integrated Circuits
  Journal of Electronic Materials, 45, 12, 6163-6170, 2016-12-01
  [ backstress , Diffusion , microstructure ]

• Si1−xGex photodiode with segregated Ge nanocrystals
  Materials Letters, 184, 308-311, 2016-12-01
  [ Electronic materials , Ge segregation , Nanocrystal , Optical materials and properties ]

• Effect of massive spalling on mechanical strength of solder joints in Pb-free solder reflowed on Co-based surface finishes
  Journal of Alloys and Compounds, 671, 100-108, 2016-06-25
  [ Co-Sn-P , Intermetallic compound , Massive spalling , Multiple reflows , SAC305 , Shear test ]

• Evolution of residual stress and qualitative analysis of Sn whiskers with various microstructures
  Journal of Materials Science, 51, 7, 3600-3606, 2016-04-01

• Disruption of crystalline structure of Sn3.5Ag induced by electric current
  , 119, 11, 2016-03-21

• Interfacial Reactions of Low-Melting Sn-Bi-Ga Solder Alloy on Cu Substrate
  Journal of Electronic Materials, 45, 1, 197-202, 2016-01-01
  [ bismuth,gallium,interfacial reaction,Low-melting solder,tin ]

• High dislocation density of tin induced by electric current
  , 5, 12, 2015-12-01

• Evolution of the Intermetallic Compounds in Ni/Sn-2.5Ag/Ni Microbumps for Three-Dimensional Integrated Circuits
  Journal of Electronic Materials, 44, 10, 3888-3895, 2015-10-05
  [ 3D IC , intermetallic compounds , kinetics analysis , Microbump ]

• In Situ Synchrotron X-ray Diffraction Measurement of the Strain Distribution in Si Die for the Embedded Substrates
  Journal of Electronic Materials, 44, 10, 3942-3947, 2015-10-05
  [ in situ strain measurement , interposer , Three-dimensional integrated circuits ]

• Metastable Ge nanocrystalline in SiGe matrix for photodiode
  Applied Surface Science, 349, 387-392, 2015-09-15
  [ High-resolution transmission electron microscopy , Metastable SiGe , Nanocrystalline Ge , Rapid thermal annealing ]

• The diminishing of crystal structure of Sn9Zn alloy due to electrical current stressing
  Journal of Alloys and Compounds, 619, 372-377, 2015-01-15
  [ Crystal structure , Current stressing , Strain , X-ray Diffraction ]

• Back-fill Sn flux against current-stressing at cathode micro Cu/Sn interface
  ECS Solid State Letters, 3, 2, 2014-03-13

• Electromigration-induced back stress in critical solder length for three-dimensional integrated circuits
  , 115, 3, 2014-02-10

• Effect of metal bond-pad configurations on the solder microstructure development of flip-chip solder joints
  Journal of Electronic Materials, 43, 1, 170-175, 2014-01-01
  [ flip chip , IC packaging , lead-free solder , microstructure ]

• Evaluation of strain measurement in a die-to-interposer chip using in situ synchrotron X-Ray diffraction and finite-element analysis
  Journal of Electronic Materials, 43, 1, 52-56, 2014-01-01
  [ 3D IC , in situ strain measurement , interposer ]

• Polarity effect in a Sn3Ag0.5Cu/bismuth telluride thermoelectric system
  Journal of Electronic Materials, 43, 1, 284-289, 2014-01-01
  [ Bi Te 2 3 , electromigration , Ni-P , peltier effect , spark plasma sintering , thermoelectric materials ]

• Kinetic analysis of spontaneous whisker growth on pre-treated surfaces with weak oxide
  Journal of Electronic Materials, 43, 9, 3290-3295, 2014-01-01
  [ Diffusion , intermetallic compounds , oxidation , synchrotron radiation x-ray ]

• High surface textured SnO 2 hybrid thin films fabricated using the nozzle-spraying process for solar cell applications
  Applied Surface Science, 277, 30-34, 2013-07-15
  [ Chemical vapor deposition , Nozzle-spraying process , Surface-textured , Thin-film solar cells , Tin oxide thin films , Transparent conducting oxide ]

• Bandgap narrowing in high dopant tin oxide degenerate thin film produced by atmosphere pressure chemical vapor deposition
  , 102, 11, 2013-03-18

• Anisotropic dissolution behavior of the second phase in SnCu solder alloys under current stress
  Scripta Materialia, 68, 5, 317-320, 2013-03-01
  [ Dissolution , Electromigration , Intermetallic compounds , Recrystallization , Synchrotron radiation ]

• Electrorecrystallization of Metal Alloy
  Journal of Alloys and Compounds, 549, 190-194, 2013-02-05
  [ Electromigration , Recrystallization , Solder , Supersaturation ]

• Reliability of micro-interconnects in 3D IC packages
  Microelectronics Reliability, 53, 1, 2013-01-01

• Massive spalling and morphological change of intermetallic compound affected by adding Pd in Co-based surface finishes
  Journal of Alloys and Compounds, 580, 195-200, 2013-01-01
  [ CoSn3 , Intermetallic compound , Mass spalling , Palladium , Surface energy ]

• Evaluation of diffusion barrier between pure Sn and Te
  Journal of Electronic Materials, 41, 12, 3320-3324, 2012-12-01
  [ Diffusion barrier , Electroless cobalt , Electroless nickel , Pb-free solder , Tellurium , Thermoelectric material ]

• Interfacial reactions between diffusion barriers and thermoelectric materials under current stressing
  Journal of Electronic Materials, 41, 12, 3325-3330, 2012-12-01
  [ Bismuth telluride , Electroless nickel , Electromigration , Thermoelectric material ]

• Analysis of chlorine ions in antimony-doped tin oxide thin film using synchrotron grazing incidence X-ray diffraction
  Japanese Journal of Applied Physics, 51, 10 PART 2, 2012-10-01

• Current redistribution by intermetallic compounds in Through-Silicon-Via (TSV)
  Materials Chemistry and Physics, 132, 1, 162-165, 2012-01-16
  [ Computer modelling and simulation , Electrical properties , Intermetallic compounds , Thin films ]

• Evaluation of diffusion barrier between lead-free solder systems and thermoelectric materials
  Journal of Electronic Materials, 41, 1, 153-158, 2012-01-01
  [ diffusion barrier , Pb-free solder , Thermoelectric ]

• Elucidating the metal-induced crystallization and diffusion behavior of Al/a-Ge thin films
  Journal of Electronic Materials, 41, 1, 159-165, 2012-01-01
  [ Al-Ge , eutectic bonding , hermetic sealing , layer exchange , MEMS packaging , MIC ]

• Nucleation and propagation of voids in microbumps for 3 dimensional integrated circuits
  , 99, 25, 2011-12-19

• Controlled positions and kinetic analysis of spontaneous tin whisker growth
  , 99, 13, 2011-09-26

• Scratch-resistant zeolite anti-reflective coating on glass for solar applications
  Solar Energy Materials and Solar Cells, 95, 7, 1694-1700, 2011-07-01
  [ AR coating , Elastic modulus , Nanoindent , Pencil hardness , Refractive index , Zeolite ]

• Preferred orientation relationships with large misfit interfaces between Ni3Sn4 and Ni in reactive wetting of eutectic SnPb on Ni
  , 109, 12, 2011-06-15

• Effects on undercooling and interfacial reactions with Cu substrates of adding Bi and in to Sn-3Ag solder
  Journal of Electronic Materials, 39, 11, 2397-2402, 2010-11-01
  [ Bismuth , Growth kinetics , Indium , Pb-free solder , Sn-Ag ]

• In situ observation of stress evolution in pure tin strip under electromigration using synchrotron radiation x-ray
  Journal of Materials Research, 25, 2, 292-295, 2010-02-01

• Journal of Electronic Materials: Foreword
  Journal of Electronic Materials, 38, 12, 2427-2428, 2009-12-01

• Determination of average failure time and microstructural analysis of Sn-Ag-Bi-In solder under electromigration
  Journal of Electronic Materials, 38, 12, 2780-2785, 2009-12-01
  [ Average failure time , Electromigration , Intermetallic compound , Pb-free solder , Sn-Ag-Bi , Sn-Ag-Bi-In ]

• Formation of intermetallic compounds in SnAgBiIn solder systems on Cu substrates
  Journal of Alloys and Compounds, 476, 1-2, 436-440, 2009-05-12
  [ Intermetallic compounds , Kinetic analysis , Pb-free solders , SnAgBiIn solder systems ]

• The suppression of tin whisker growth by the coating of tin oxide nano particles and surface treatment
  Microelectronics Reliability, 49, 3, 318-322, 2009-03-01

• The effects of solid-state aging on the intermetallic compounds of Sn-Ag-Bi-In solders on Cu substrates
  Journal of Electronic Materials, 38, 2, 252-256, 2009-02-01
  [ Kirkendall void , Pb-free , Sn-Ag-Bi-In solder , Solid-state aging ]

• In situ measurements of thermal and electrical effects of strain in flip-chip silicon dies using synchrotron radiation x-rays
  Journal of Electronic Materials, 38, 11, 2308-2313, 2009-01-01
  [ Electromigration , Flip chip , Measurement , Silicon die , Strain , Synchrotron radiation x-rays , Thermal effect ]

• Direct observation and kinetic analysis of grain rotation in anisotropic tin under electromigration
  , 92, 12, 2008-04-03

• Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads
  Journal of Electronic Materials, 36, 7, 753-759, 2007-07-01
  [ Current crowding , Electromigration , Flip chip , Joule heating , Sn-8Zn-3Bi ]

• Stress analysis of spontaneous Sn whisker growth
  Journal of Materials Science: Materials in Electronics, 18, 1-3, 269-281, 2007-03-01

• Interfacial stability of eutectic SnPb solder and composite 60Pb40Sn solder on Cu/Ni(V)/Ti under-bump metallization
  Journal of Materials Research, 22, 3, 735-741, 2007-03-01

• Mechanism and prevention of spontaneous tin whisker growth
  Materials Transactions, 46, 11, 2300-2308, 2005-11-01
  [ Lead-free , Spontaneous growth , Tin whisker , X-ray microdiffraction ]

• Electromigration-induced grain rotation in anisotropic conducting beta tin
  , 86, 24, 1-3, 2005-06-13

• Electromigration-induced microstructure evolution in tin studied by synchrotron x-ray microdiffraction
  , 85, 13, 2490-2492, 2004-09-27

研討會著作

• Cu Nanoparticle Sintering by Electrical Current
  107-108, 2024-01-01
  [ Cu nanoparticle,Current crowding,Electrical current,Joule heating,Sintering ]

• Develop new solder alloy for high reliability device
  1144-1147, 2024-01-01
  [ drop test,high reliability,solder joint,TCT,thermal fatigue ]

• Hybrid SnBi/SAC Low-Temperature Solder Bump
  213-214, 2023-01-01
  [ low-temperature solder,mechanical strength,SAC,SnBi ]

• Corrosion resistance of surface finishes for high reliability devices
  206-209, 2019-01-24
  

• Development of low temperature solder alloys for advanced electronic packaging: Assessment of In-Bi alloys on Cu substrates
  128-131, 2018-06-06
  [ Bi , In , Low temperature alloy ]

• Creep corrosion on high reliability printed circuit boards
  156-158, 2016-12-27
  

• Development of New Low Melting Solder Alloys
  2501-2506, 2016-08-16
  [ Ga , In-Bi , Low metling point solder ]

• Non-destructive testing method for chip warpage -Applications of synchrotron radiation X-ray
  15-18, 2016-06-07
  [ Si-on-Si interposer , Synchrotron radiation X-ray , Warpage ]

• Massive spalling in Pb-free solder on co-based surface finishes
  586-589, 2015-01-01
  [ Cobalt , massive spalling , shear strenrth , surface finish ]

• Analysis of antimony doped SnO 2 thin film by synchrotron grazing incidence X-ray diffraction
  001768-001770, 2011-12-01
  

• Electrical current induced local thermal stress caused on stacked 3D-ICs
  2010-12-01
  

• The in-situ measurement of thermal stress on stacked 3D-IC by utilizing synchrotron radiation x-ray
  2010-12-01
  

• The composition of intermetallic compounds in Sn-Ag-Bi-In solders on Cu substrates
  209-211, 2008-12-01
  

• Synchrotron X-ray micro-diffraction analysis on microstructure evolution in Sn under electromigratton
  363-367, 2005-12-19
  

• Microstructure evolution of tin under electromigration studied by synchrotron x-ray micro-diffraction
  178-180, 2005-12-01
  

專書

• Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics
  269-281, 2007-12-01